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John H. Lau | lit.salon

Author

John H. Lau

25 works

1991–2024 across 24 dated works

No biography is available yet.

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Solder joint reliability: theory and applications1991
Handbook of tape automated bonding1992
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)1993
Thermal stress and strain in microelectronics packaging1993

Books

24 works

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Electronic packaging: design, materials, process, and reliability1998
With C.P. Wong, J.L. Prince
3 editions
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Solder joint reliability: theory and applications1991
3 editions
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Microvias: For Low Cost, High Density Interconnects2001
With S.W. Ricky Lee
2 editions
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications1999
With Ricky S.W. Lee, Ricky S. Lee
2 editions
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies2000
2 editions
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Semiconductor Advanced Packaging2021
3 editions
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Fan-Out Wafer-Level Packaging2018
3 editions
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Flip chip technologies1996
1 edition
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Handbook of fine pitch surface mount technology1994
1 edition
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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies1997
1 edition
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Chip on board technologies for multichip modules1994
1 edition
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Ball grid array technology1995
1 edition
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Advanced MEMS packaging2010
1 edition
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Thermal stress and strain in microelectronics packaging1993
1 edition
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Handbook of tape automated bonding1992
1 edition
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Chiplet Design and Heterogeneous Integration Packaging2023
2 editions
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Heterogeneous Integrations2019
2 editions
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Assembly and Reliability of Lead-Free Solder Joints2020
With Ning-Cheng Lee
2 editions
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)1994
1 edition
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Reliability Of Rohscompliant 2d And 3d Ic Interconnects2010
1 edition
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Solder Joint Reliability: Theory and applications1991
1 edition
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Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)1993
1 edition
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology2024
1 edition
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Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials2002
With C.P. Wong, Ning-Cheng Lee, Ricky S.W. Lee
3 editions
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