Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
by John H. Lau
1997408 pages
McGraw-Hill·1 editions
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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies (1997)
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies (1997)
McGraw-Hill
McGraw-Hill
ISBN 10: 0070366489