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Ning-Cheng Lee | lit.salon

Author

Ning-Cheng Lee

4 works

2002–2020 across 3 dated works

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Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies2002
Reflow Soldering Processes2002
Assembly and Reliability of Lead-Free Solder Joints2020
With John H. Lau

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3 works

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Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies2002
1 edition
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Assembly and Reliability of Lead-Free Solder Joints2020
With John H. Lau
2 editions
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Reflow Soldering Processes2002
1 edition
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