Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
by John H. Lau
2000585 pages
McGraw-Hill Professional·2 editions
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (2000)
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (2000)
McGraw-Hill Professional
McGraw-Hill Professional
ISBN 10: 0071351418
ISBN 13: 9780071351416