Materials, Integration and Packaging Issues for High-Frequency Devices II
by Yong S. Cho
2005270 pages
Materials Research Society·1 editions
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Materials, Integration and Packaging Issues for High-Frequency Devices II (2005)
Materials, Integration and Packaging Issues for High-Frequency Devices II (2005)
Materials Research Society
Materials Research Society
Hardcover
ISBN 10: 1558997814
ISBN 13: 9781558997813