Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
by K. Otsuka
1899256 pages
Springer·1 editions
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module (1899)
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module (1899)
Springer
Springer
Hardcover
ISBN 10: 185166579X
ISBN 13: 9781851665792