The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
by Gerard Kelly
1999134 pages
Springer·1 editions
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (1999)
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages (1999)
Springer
Springer
Hardcover
ISBN 10: 0792384857
ISBN 13: 9780792384854