Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III
by R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
19973000 pages
Springer·1 editions
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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III (1997)
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III (1997)
Springer
Springer
Hardcover
ISBN 10: 0412084619
ISBN 13: 9780412084614