Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
by Jie Cheng
2017137 pages
Springer·2 editions
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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (2017)
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (2017)
Springer
Springer
hardcover
ISBN 10: 9811061645
ISBN 13: 9789811061646