Modeling and Application of Flexible Electronics Packaging
by YongAn Huang, Zhouping Yin, Xiaodong Wan
2019287 pages
Springer·1 editions
Loading Description
Tags
NewBookshelves
0 readersNo users with this book on their shelves. Maybe you could be the first.
Threads
0 discussionsQuotes
0 quotesReviews
0 reviewsNo reviews yet. Add your review.
Lists
0 listsNo lists containing this book.
Purchasable Editions
1 editionsThe Amazon links are affiliate links
Modeling and Application of Flexible Electronics Packaging (2019)
Modeling and Application of Flexible Electronics Packaging (2019)
Springer
Springer
hardcover
ISBN 10: 9811336261
ISBN 13: 9789811336263