Microelectronics Packaging Fund
by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
2001864 pages
International Thomson Publishing Services Ltd·1 editions
Loading Description
Tags
NewBookshelves
0 readersNo users with this book on their shelves. Maybe you could be the first.
Threads
0 discussionsQuotes
0 quotesReviews
0 reviewsNo reviews yet. Add your review.
Lists
0 listsNo lists containing this book.
Purchasable Editions
1 editionsThe Amazon links are affiliate links
Microelectronics Packaging Fund (2001)
Microelectronics Packaging Fund (2001)
International Thomson Publishing Services Ltd
International Thomson Publishing Services Ltd
Hardcover
ISBN 10: 041214901X
ISBN 13: 9780412149016