Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)
2002200 pages
INSPEC, Inc.·2 editions
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Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1) (2002)
Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1) (2002)
INSPEC, Inc.
INSPEC, Inc.
Hardcover
ISBN 10: 0852960395
ISBN 13: 9780852960394